Alright, over the past fews days I have read 40 pages of technical data (that was loads of fun), but in the process I figured out the differences in all the versions of the MCP3208. I am going with the MCP3208 BI/SL. I chose the 'B' because it is more accurate than the 'C' and the 'I' just means it has an industrial temperature rating. 'SL' just means it has a SOIC package.
Once I figured that out, I started working on a PCB break out board for the ADC so it would be easier to work with. Once I finish that, I'll post a link to it on BatchPCB, SparkFun's cheap PCB prototyping service.
I have also started trying to figure out the functional theory behind the XY ir sensor and the way it is mounted. I get how the tempurature differences correlate to pitch and roll. What I don't get is how it works when mounted diagonally. You can follow how that goes here, or you can click the title of this post.
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